1. An LVDS
The LVDS output interface USES very low voltage fluctuation (about
**0mV) to transmit data through the differential data of two PCB
lines or a pair of balanced cables. Low voltage differential signal
transmission. Put forward a kind of an LVDS output interface, this
interface can make the difference balance PCB line or cable
transmission signal transmitted at the speed of several hundred
megabit per second, therefore, low voltage and low current drive
mode to achieve the low noise and low power consumption. At
present, the LVDS output interface is widely used in the LCD screen
of *7in and above. Its benefits and functions are as follows:
(1) high-speed transmission capacity
(2) low noise/low electromagnetic interference
(3) low power consumption
(4) low voltage
2. The HOTBAR
Hot hot molten solder, will need to connect the two electronic
components connected, flat solder (usually FPC or FFC) with a long
belt thermal head welding on the circuit boards or connector, so it
is called the HotBar. It is different from the thermal sealing
process of ACF on the LCD or circuit board. The hot rod is usually
used to weld the soft board (FPC/FFC) onto the PCB or connector to
make it light, thin, short, small, and effectively reduce the
production cost.
3. Gold-plating process
Gold element has a low contact resistance, good conductivity, easy
to welding, corrosion resistance is strong, and has a certain wear
resistance (refers to solid gold), therefore, electric plating in
precision instruments, printed circuit board, integrated circuit,
FFC contact, electrical equipment, electric contact is widely used
in such aspects.
Due to welding solder formation of intermetallic compounds are Ni
(Sn - Ni compound), and Au plating layer is used to protect the Ni
layer, therefore, FFC contact before plating need as electroplating
with nickel material base (other such as zinc, lead and zinc alloy
surface treatment are also made at the bottom of the Ni to
material). In addition, the nickel plating layer is mainly as a
barrier layer between copper and gold layer, can prevent spread of
gold and copper with each other, influence the weldability and
service life of the products, at the same time, nickel base layer
can greatly increase the mechanical strength of plating layer,
color, gloss and color stability.
2. Narrow slit: the laser beam focuses on a small point of light,
which causes the focal point to reach a high power density. The
material is quickly heated to the degree of gasification, and
evaporation forms the hole. With the relative linear movement of
the beam and the material, the hole is continuously formed in a
narrow slit. The cutting is usually 0.**0.2mm.
3. Smooth cutting surface: the cutting surface has no burrs, and
the surface roughness of the incision is generally controlled in
Ral2.5; In A.
4. Speed: cutting speed can reach l0m/min, faster than line
cutting.
5. Good cutting quality: no contact cutting, the cutting edge is
very small, there is no thermal deformation of the workpiece,
completely avoid the collapse of the material in the cutting, and
the cutting is not required to be processed twice.
6. No damage to the workpiece: the laser cutting head will not
contact the surface of the material and will not scratch the work
piece.
2. Die cutting processing
(1) high production efficiency. Maximum speed can reach **0~
**0m/MLN.
(2) good quality of die cutting. Die cutting is the way of wire
contact processing. The working pressure small product has good
forming stability and the geometrical shape is accurate.
(3) high precision of die cutting. The die cutting machine is
equipped with a high precision set and die cutting phase adjustment
device, which can obtain quite high die cutting precision.
